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180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging

Name: 180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging
Brand: Shenzhen Hiner Technology Co., Ltd.
SKU: HN24220
Price: 1.35 USD
Availability: InStock

Nama merek:	Hiner-pack
Nomor Model:	HN24220
Moq:	500 buah
harga:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Ketentuan Pembayaran:	T/T
Kemampuan Penyediaan:	2000 buah/hari

Informasi Rinci

Deskripsi Produk

Informasi Rinci

Tempat asal:

Cina

Sertifikasi:

ROHS, ISO

Berat Baki:

Bervariasi, Biasanya Hingga 500 Gram Per Rongga

Warna:

Biasanya berwarna hitam atau abu-abu tua untuk perlindungan ESD

Jaminan Kualitas:

Jaminan pengiriman, kualitas terpercaya

Ukuran Rongga:

4x5x1,6 mm

Incoterms:

Exw, fob, cif, ddu, ddp

Jenis cetakan:

Injeksi

Dapat digunakan kembali:

Bentuk Baki:

Persegi panjang

Kelas Bersih:

Pembersihan umum dan ultrasonik

Tipe IC:

BGA,QFP,QFN,LGA,PGA

Tingkat pengepakan:

Paket Transportasi

Kebosanan:

Kurang dari 0,76mm

Kapasitas:

13x28=364 buah

Kemasan rincian:

karton, palet

Menyediakan kemampuan:

2000 buah/hari

Menyoroti:

180°C high temp JEDEC tray

ESD protection JEDEC IC tray

semiconductor packaging JEDEC tray

Deskripsi Produk

High Temp ESD JEDEC Tray for AI Chips Packaging

This JEDEC tray is specially designed for high temperature semiconductor processes, such as baking, burn-in, and AI chip packaging.
It ensures dimensional stability and precise positioning during automated handling.

Key Features/ Benefits

Up to 180°C high temperature resistant (PEI material)
Stable ESD protection (1E4–1E11 Ω)
Compatible with ASM / Advantest / YAMAHA machines
Free design within 24 hours
JEDEC standard footprint

Specifications

Brand		Hiner-pack
Model		HN24220
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×7.62 mm
Cavity Size		4x5x1.6 mm
Matrix QTY		13x28=364 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

These trays are ideal for electronics manufacturing, assembly lines, cleanroom environments, and automated handling systems. Their versatility extends to acrylic tray displays and inventory management applications.

AI chips / GPU / ASIC
BGA / QFN / IC packaging
Burn-in & baking process
Production line buffering

Packaging & Shipping/ Services

JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

10+ years semiconductor packaging experience
In-house mold design capability
OEM & ODM customization supported
Consistent quality and stable supply
Daily capacity: 2000+ pcs

Tag:

Tautan Cepat

Rumah Tentang kami Produk Kasus-kasus Berita unduh Hubungi Kami

Kontak Cepat

Alamat

Bangunan A11, Zona D, Zona Industri Barat, Komunitas Minzhu, Jalan Shajing, Distrik Baoan, Kota Shenzhen, Provinsi GD CN

Telp

86-0755-23229236-816

E-mail

Rainbowzhu@hiner-pack.com

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180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging

180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging

180°C high temp JEDEC tray

ESD protection JEDEC IC tray

semiconductor packaging JEDEC tray

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