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Deep Pocket JEDEC Tray for Large IC Modules with Reusable Design

Name: Deep Pocket JEDEC Tray for Large IC Modules with Reusable Design
Brand: Shenzhen Hiner Technology Co., Ltd.
SKU: HN24225
Price: 1.35 USD
Availability: InStock

Nama merek:	Hiner-pack
Nomor Model:	HN24225
Moq:	500 buah
harga:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Ketentuan Pembayaran:	T/T
Kemampuan Penyediaan:	2000 buah/hari

Informasi Rinci

Deskripsi Produk

Informasi Rinci

Tempat asal:

Cina

Sertifikasi:

ROHS, ISO

Berat Baki:

Bervariasi, Biasanya Hingga 500 Gram Per Rongga

Warna:

Biasanya berwarna hitam atau abu-abu tua untuk perlindungan ESD

Jaminan Kualitas:

Jaminan pengiriman, kualitas terpercaya

Ukuran Rongga:

48,5x45,5mm

Incoterms:

Exw, fob, cif, ddu, ddp

Jenis cetakan:

Injeksi

Dapat digunakan kembali:

Bentuk Baki:

Persegi panjang

Kelas Bersih:

Pembersihan umum dan ultrasonik

Tipe IC:

BGA,QFP,QFN,LGA,PGA

Tingkat pengepakan:

Paket Transportasi

Kebosanan:

Kurang dari 0,76mm

Kapasitas:

2x5 = 10 buah

Kemasan rincian:

karton, palet

Menyediakan kemampuan:

2000 buah/hari

Menyoroti:

Deep Pocket JEDEC IC tray

Large IC module storage tray

JEDEC standard IC holder

Deskripsi Produk

Deep Pocket JEDEC Tray for Large IC Modules

Ideal for large or thick semiconductor devices, ensuring secure placement.

Key Features/ Benefits

Deep cavity for large components
Strong structural support
Prevents damage during transport
Custom pocket design

Specifications

Brand		Hiner-pack
Model		HN24225
Material		PPE
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×10.6 mm
Cavity Size		48.5x45.5 mm
Matrix QTY		2x5=10 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices

Power modules
Industrial IC
Large semiconductor devices

Packaging & Shipping/ Services

JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Automotive project experience
In-house mold design capability
Fast prototype development
Strict material control
Stable supply for global semiconductor customers

Tag:

Tautan Cepat

Rumah Tentang kami Produk Kasus-kasus Berita unduh Hubungi Kami

Kontak Cepat

Alamat

Bangunan A11, Zona D, Zona Industri Barat, Komunitas Minzhu, Jalan Shajing, Distrik Baoan, Kota Shenzhen, Provinsi GD CN

Telp

86-0755-23229236-816

E-mail

Rainbowzhu@hiner-pack.com

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Deep Pocket JEDEC Tray for Large IC Modules with Reusable Design

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