Brief: Discover the Custom Optoelectronic Chip Waffle Pack Tray Cover Clip, made from high-quality PC and PP materials. Perfect for securing wafer particles and small electronic components during transport, this packaging ensures stability and protection. Ideal for ICs, semiconductors, and microsystems, it offers custom solutions with free samples and expert support.
Related Product Features:
Custom waffle pack tray cover and clip made from durable PC and PP materials.
Ensures product stability during transport with secure placement.
Available in standard sizes like 101.6*101.6*7.11mm with black color option.
Features a cavity size of 5.69*4.28*1.3mm and matrix QTY of 11*13=143PCS.
Offers high resistance (1.0x10e4-1.0x10e11Ω) and ROHS certification.
Provides free samples after mold customization for quality assurance.
Suitable for ICs, electronic components, semiconductors, and sensor ICs.
Accepts OEM and ODM services with one-stop design to shipping support.
Pertanyaan:
How can I get a quotation for the Custom Optoelectronic Chip Waffle Pack Tray?
Please provide clear details of your requirements, and we will send you an offer promptly. For faster communication, contact us via Skype, Email, Phone, or Whatsapp.
What is the delivery time for responses to inquiries?
We guarantee a response within 24 hours on working days to address your questions or concerns.
How do you ensure the quality of your waffle pack trays?
Our samples undergo strict testing, and finished products comply with international JEDEC standards to ensure a 100% qualified rate.
What delivery terms do you accept?
We offer various delivery terms including EXW, FOB, CIF, DDU, and DDP, allowing you to choose the most convenient or cost-effective option.