Produk

Rumah / Produk / Nampan Bare Die /

Custom 17*26 PCS Bare Die Tray with Lid and Clip for Transportation

Name: Custom 17*26 PCS Bare Die Tray with Lid and Clip for Transportation
Brand: Shenzhen Hiner Technology Co., Ltd.
SKU: HN24079
Price: 0.35 USD
Availability: InStock

Nama merek:	Hiner-pack
Nomor Model:	HN24079
Moq:	1000 Pcs
harga:	$0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities）
Ketentuan Pembayaran:	T/T
Kemampuan Penyediaan:	4000PCS~5000PCS/per Day

Informasi Rinci

Deskripsi Produk

Informasi Rinci

Tempat asal:

Shenzhen, Cina

Sertifikasi:

ROHS

Jumlah rongga:

17*26 = 442pcs

Milik:

ESD, non-ESD

Warpage:

＜ 0.3mm

Opsional:

Tutup/penutup dan klip/klem

logo khusus:

Tersedia

Membentuk:

Persegi panjang

Kebosanan:

<0,3mm

Metode cetakan:

Cetakan Injeksi

Packaging Details:

It Depends On The QTY Of Order And Size Of Product

Supply Ability:

4000PCS~5000PCS/per Day

Deskripsi Produk

Product Description:

These innovative Die Mounting Trays are manufactured using the top-quality Injection Moulding method, ensuring durability and precision in every tray. The injection moulding process guarantees a high level of consistency and accuracy, making these trays ideal for safely transporting and storing your valuable bare die components.For added convenience and protection, our Bare Die Trays come with optional lids/covers and clips/clamps. These accessories provide extra security for your components during handling and transportation, giving you peace of mind knowing that your bare die components are well-protected.

Technical Parameters:

Color	Black
Warpage	＜0.3mm
Property	ESD, Non-ESD
Optional	Lid/Cover And Clip/Clamp
Number Of Cavities	17*26=442pcs
Molding Method	Injection Moulding
Custom Logo	Available
Application	Transport, Storage, Packing Of Bare Die

Applications:

♠Mobile RFID Readers:

Supports high-density electronic integration for portable devices.

♠Industrial Control Systems:

Allows multi-chip module (MCM) integration on single substrates.

♠High-Reliability Military Systems:

Provides low-volume semiconductor packaging options with flexible order quantities.

♠Automotive Electronics:

Enables power management and DSP integration in compact form factors.

Packing and Shipping:

Product Name: Bare Die Trays

Description: Our Bare Die Trays are designed to securely hold and protect delicate bare dies during shipping and storage.

Package Includes: 100 Bare Die Trays

Shipping Method: Standard Shipping

Estimated Delivery Time: 3-5 business days

Tag:

Tautan Cepat

Rumah Tentang kami Produk Kasus-kasus Berita unduh Hubungi Kami

Kontak Cepat

Alamat

Bangunan A11, Zona D, Zona Industri Barat, Komunitas Minzhu, Jalan Shajing, Distrik Baoan, Kota Shenzhen, Provinsi GD CN

Telp

86-0755-23229236-816

E-mail

Rainbowzhu@hiner-pack.com

sweet_34

Surat Kabar Kami

Langganan buletin kami untuk diskon dan banyak lagi.

JEDEC IC Baki

Nampan Matriks JEDEC

Baki Chip IC

Baki JEDEC Kustom

Nampan Keripik Waffle Pack

Baki Komponen Elektronik

Nampan Bare Die

Nampan Anti Statis

Klip Tutup Paket Wafel

Kotak Lengket Gel

Kotak Pengiriman Wafer

Kaset Wafer Logam

JEDEC IC Baki

Nampan Matriks JEDEC

Baki Chip IC

Baki JEDEC Kustom

Nampan Keripik Waffle Pack

Baki Komponen Elektronik

Nampan Bare Die

Nampan Anti Statis

Klip Tutup Paket Wafel

Kotak Lengket Gel

Kotak Pengiriman Wafer

Kaset Wafer Logam

Custom 17*26 PCS Bare Die Tray with Lid and Clip for Transportation

Custom 17*26 PCS Bare Die Tray with Lid and Clip for Transportation

Product Description:

Technical Parameters:

Applications:

Packing and Shipping:

ODM Bare Die Trays

CSP Bare Die Trays

CSP Chip Scale Package Trays

Tampilan Kombinasi Chip Bare Die Baki Untuk Komponen Elektronik Sensitif

Baki Transfer Chip IC Antistatik Persegi Biasa Ramah Lingkungan

Memuat Baki IC Plastik Wafer Bare 2 Inch ESD Shipping Baki

ODM Anti Static Bare Die Baki Paket Skala Chip CSP Mengangkut IC

3 Inch Waffle Pack Bare Die Baki 44PCS Ramah Lingkungan