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Heat-Proof Antistatic JEDEC Matrix Trays For IC Components With Injection Molding

Nama merek:	Hiner-pack
Nomor Model:	HN24117
Moq:	500pcs
harga:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Ketentuan Pembayaran:	100% Prepayment
Kemampuan Penyediaan:	2000PCS/Day

Informasi Rinci

Deskripsi Produk

Informasi Rinci

Tempat asal:

Shenzhen China

Sertifikasi:

RoHS、ISO

Layanan yang Disesuaikan:

Mendukung standar dan non-standar

Matriks:

4*7 = 28 buah

Tahan lama:

Bahan:

MPPO

Dapat ditumpuk:

Resistensi permukaan:

1.0x10E4~1.0x10E11Ω

Metode cetakan:

Cetakan Injeksi

Packaging Details:

70~100pcs/carton(According To The Customer Demand）

Supply Ability:

2000PCS/Day

Menyoroti:

Surface Resistance 1.0x10E4~1.0x10E11Ω JEDEC Matrix Trays

Matrix 8*18=144PCS JEDEC Trays

Durable IC Component Trays

Deskripsi Produk

Heat-Proof Antistatic JEDEC Matrix Trays For IC Components With Injection Molding

JEDEC (Joint Electronic Device Engineering Council - www.jedec.org) creates open standards for the microelectronics industry, ensuring product interoperability, benefiting the industry and ultimately consumers by reducing product development time and costs while increasing efficiency and productivity.

JEDEC trays all are the same size, with a standardized outline, and required features. Putting parts in a JEDEC tray ensures that your parts can be processed in industry-standard automation equipment like pick and place machines, inspection, laser marking, testing, and dispensing equipment. Commercially available JEDEC tray feeders can be easily added to custom process machines. When you use JEDEC trays, you get an instant benefit from decades of experience and access to an installed base and continuing supply of automation tools.

The maximum baking temperature is stamped into JEDEC trays. Exceeding the stated maximum baking temperature will cause the dimensions of the tray to alter; thus, potentially damaging the contents. The type of molding compound used during the tray's manufacture determines the tray's maximum temperature rating. Multiple compounds and/or powders are mixed together during the molding process to add specific features such as color, ESD properties, dimensional stability and maximum temperature ratings.

Features:

In general, JEDEC trays are custom designed and manufactured. Many of them are not only device specific but device manufacturer specific.
It's not uncommon for two component sources' parts to require different trays because of allowable variation in package sizing.
Off-the-shelf simply means a manufacturer has enough demand for a specific custom tray that they carry some inventory.
More common is open-tooled where a custom mold will be set up and run for any order but often with a minimum quantity and/or significant setup charges.

Technical Parameters:

Brand	Hiner-pack	Outline Line Size	322.6x135.9x7.62mm
Model	HN24117	Cavity Size	106.452.6mm
Material	MPPO	Matrix QTY	4*7=28PCS
Package Type	IC Component	Flatness	MAX 0.76mm
Color	Black	Service	Accept OEM, ODM
Resistance	1.0x10e4-1.0x10e11Ω	Certificate	RoHS, IOS

Applications:

Packaging: At their core, trays are simply containers. The JEDEC tray outline includes features for stacking, whereby each successive tray becomes the cover for the tray below.
Transportation & Storage: Parts loaded into stacked JEDEC trays are easy to store or transport, across the room or around the world. JEDEC trays also function as process "boats", transporting their contents through a variety of process tools and equipment.
Protection: JEDEC trays protect the parts they hold from mechanical damage. Most JEDEC trays are manufactured using materials that also provide electrical protection from electrostatic discharge (ESD) damage.

Tag:

JEDEC IC Baki

Nampan Matriks JEDEC

Baki Chip IC

Baki JEDEC Kustom

Nampan Keripik Waffle Pack

Baki Komponen Elektronik

Nampan Bare Die

Nampan Anti Statis

Klip Tutup Paket Wafel

Kotak Lengket Gel

Kotak Pengiriman Wafer

Kaset Wafer Logam

JEDEC IC Baki

Nampan Matriks JEDEC

Baki Chip IC

Baki JEDEC Kustom

Nampan Keripik Waffle Pack

Baki Komponen Elektronik

Nampan Bare Die

Nampan Anti Statis

Klip Tutup Paket Wafel

Kotak Lengket Gel

Kotak Pengiriman Wafer

Kaset Wafer Logam

Heat-Proof Antistatic JEDEC Matrix Trays For IC Components With Injection Molding

Heat-Proof Antistatic JEDEC Matrix Trays For IC Components With Injection Molding

Surface Resistance 1.0x10E4~1.0x10E11Ω JEDEC Matrix Trays

Matrix 8*18=144PCS JEDEC Trays

Durable IC Component Trays

ESD JEDEC Matrix Trays

SGS JEDEC Matrix Trays

SGS JEDEC Tray

Tray Matriks ESD yang Digunakan Kembali Tray Pengiriman IC JEDEC Untuk Perangkat Optik

SGS Plastic Black ESD JEDEC Matrix Baki Untuk Produk Elektronik

Modul PCB Kemasan ESD JEDEC Matrix Baki 21PCS Tahan Suhu Tinggi

Pemasok Baki JEDEC Hitam Anti Korosif Pemuatan Siklus Untuk Sensor Nano

PES Material ESD JEDEC Matrix Tray Warpage Kurang dari 0,76mm