Produk

Rumah / Produk / Nampan Matriks JEDEC /

Standard JEDEC IC Tray For AI semiconductor manufacturing progress

Nama merek:	Hiner-pack
Nomor Model:	HN23072
Moq:	500 buah
harga:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Ketentuan Pembayaran:	100% Pembayaran di muka
Kemampuan Penyediaan:	2000 buah/hari

Informasi Rinci

Deskripsi Produk

Informasi Rinci

Tempat asal:

Cina

Sertifikasi:

RoHS、ISO

Matriks:

4×13 = 52 buah

Resistensi kelembaban:

Hingga 90%

Ukuran Rongga:

21.18x16.08x2.6mm

Kapasitas berat:

Bervariasi, Biasanya Hingga 500 Gram Per Rongga

Resistensi UV:

halaman melengkung:

Kurang dari 0,76mm

Dapat digunakan kembali:

Dapat digunakan kembali

Aplikasi:

Penanganan, Penyimpanan, dan Pengiriman IC

Kemasan rincian:

70 ~ 100pcs/karton (Sesuai dengan permintaan pelanggan）

Menyediakan kemampuan:

2000 buah/hari

Deskripsi Produk

Standard JEDEC IC Tray For AI semiconductor manufacturing progress

This JEDEC-compliant matrix tray is tailored for manufacturers who require high-performance handling solutions in precision electronics environments. Made with static-dissipative material, it delivers essential ESD protection while maintaining structural uniformity during repeated handling cycles.

Its integrated locating and alignment features support fast and accurate positioning on automated lines, while molded pockets ensure secure device containment throughout testing, assembly, and shipment.

Key Features/ Benefits

Fully conforms to JEDEC outline requirements for compatibility with global processing equipment.
Made from conductive materials that provide consistent ESD protection, helping safeguard sensitive components.
Precision-formed cells hold parts securely in fixed orientations, reducing handling errors and device shift.
Designed for compatibility with vacuum pickup tools, mechanical arms, and inline feeding systems.
Withstands operational stress during processing and storage while retaining tray flatness and pocket integrity.
Interlocking edges allow for stable, space-saving stacking, whether in-process or in storage.

Specifications

Brand		Hiner-pack
Model		HN23072
Material		MPPO/PPE
Package Type		BGA,QFP,QFN,LGA,PGA
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×7.62 mm
Cavity Size		21.18x16.08x2.6mm
Matrix QTY		4×13=52PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Certifications		RoHS, ISO

Applications

These trays are ideal for electronics manufacturing, assembly lines, cleanroom environments, and automated handling systems. Their versatility extends to acrylic tray displays and inventory management applications.

Engineered for IC assembly, automated inspection, and semiconductor testing
Ideal for operations where speed and handling precision are key.
From chip-level packaging to system module assembly—and integrates easily into both inline and batch-process setups.
Ensures reliable positioning and part safety at every stage, in a cleanroom or on a standard production floor.

Customization:

The tray’s flexible design supports a wide range of customized configurations to meet specific production challenges:

• Tailored Pocket Layouts: Adjust pocket size, count, or spacing to match non-standard part dimensions or shapes.

• Color Coding Options: Use ESD-safe materials in selected colors for identifying product types, workstations, or production phases.

• In-Mold Marking: Add customer-specific identifiers or tracking features during manufacturing for clear and permanent identification.

• Specialized Alignment Features: Modify edges or add tool-specific indexing tabs to optimize performance in proprietary handling systems.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Factory-direct manufacturer of JEDEC & IC trays
JEDEC compliant, automation-compatible designs
OEM & ODM customization supported
Consistent quality and stable supply
Trusted by global semiconductor customers

Tag:

JEDEC IC Baki

Nampan Matriks JEDEC

Baki Chip IC

Baki JEDEC Kustom

Nampan Keripik Waffle Pack

Baki Komponen Elektronik

Nampan Bare Die

Nampan Anti Statis

Klip Tutup Paket Wafel

Kotak Lengket Gel

Kotak Pengiriman Wafer

Kaset Wafer Logam

JEDEC IC Baki

Nampan Matriks JEDEC

Baki Chip IC

Baki JEDEC Kustom

Nampan Keripik Waffle Pack

Baki Komponen Elektronik

Nampan Bare Die

Nampan Anti Statis

Klip Tutup Paket Wafel

Kotak Lengket Gel

Kotak Pengiriman Wafer

Kaset Wafer Logam

Standard JEDEC IC Tray For AI semiconductor manufacturing progress

Standard JEDEC IC Tray For AI semiconductor manufacturing progress

Customization:

ESD JEDEC Matrix Trays

SGS JEDEC Matrix Trays

SGS JEDEC Tray

Tray Matriks ESD yang Digunakan Kembali Tray Pengiriman IC JEDEC Untuk Perangkat Optik

SGS Plastic Black ESD JEDEC Matrix Baki Untuk Produk Elektronik

Modul PCB Kemasan ESD JEDEC Matrix Baki 21PCS Tahan Suhu Tinggi

Pemasok Baki JEDEC Hitam Anti Korosif Pemuatan Siklus Untuk Sensor Nano

PES Material ESD JEDEC Matrix Tray Warpage Kurang dari 0,76mm