logo
Produk
Rumah / Produk / JEDEC IC Baki /

High Storage Efficiency Lightweight JEDEC Tray with ESD Protection for IC Packaging

High Storage Efficiency Lightweight JEDEC Tray with ESD Protection for IC Packaging

Nama merek: Hiner-pack
Nomor Model: HN24230
Moq: 500 buah
harga: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Ketentuan Pembayaran: T/T
Kemampuan Penyediaan: 2000 buah/hari
Informasi Rinci
Tempat asal:
Cina
Sertifikasi:
ROHS, ISO
Berat Baki:
Bervariasi, Biasanya Hingga 500 Gram Per Rongga
Warna:
Biasanya berwarna hitam atau abu-abu tua untuk perlindungan ESD
Jaminan Kualitas:
Jaminan pengiriman, kualitas terpercaya
Ukuran Rongga:
11x16.3x2.47mm
Incoterms:
Exw, fob, cif, ddu, ddp
Jenis cetakan:
Injeksi
Dapat digunakan kembali:
Ya
Bentuk Baki:
Persegi panjang
Kelas Bersih:
Pembersihan umum dan ultrasonik
Tipe IC:
BGA,QFP,QFN,LGA,PGA
Tingkat pengepakan:
Paket Transportasi
Kebosanan:
Kurang dari 0,76mm
Kapasitas:
6x18 = 108 buah
Kemasan rincian:
karton, palet
Menyediakan kemampuan:
2000 buah/hari
Menyoroti:

JEDEC IC tray for packaging

,

thin JEDEC IC tray

,

IC packaging tray with warranty

Deskripsi Produk
Thin JEDEC Tray for IC Packaging 
Designed for high-level semiconductor cleanroom environments, this tray minimizes contamination and ensures IC integrity.
Key Features/ Benefits 
  • Lower cost solution
  • Lightweight design
  • High storage efficiency
  • Easy handling
Specifications
Brand Hiner-pack
Model  HN24230
Material  MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 11x16.3x2.47 mm
Matrix QTY 6x18=108 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices
  • Consumer IC
  • Standard packaging
  • Semiconductor fabs
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers