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ESD Anti Static Semiconductor Waffle Chip Trays

Nama merek:	Hiner-pack
Nomor Model:	HN24171
Moq:	500 buah
harga:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Ketentuan Pembayaran:	T/T
Kemampuan Penyediaan:	2000 buah/hari

Informasi Rinci

Deskripsi Produk

Informasi Rinci

Tempat asal:

Cina

Sertifikasi:

ROHS, ISO

Berat Baki:

Bervariasi, Biasanya Hingga 500 Gram Per Rongga

Warna:

Hitam

Jaminan Kualitas:

Jaminan pengiriman, kualitas terpercaya

Ukuran Garis Garis Besar:

50,8×50,8×3,94mm

Ukuran Rongga:

4.64x4.22x0.755mm

Incoterms:

Exw, fob, cif, ddu, ddp

Jenis cetakan:

Injeksi

Dapat digunakan kembali:

Bentuk Baki:

Persegi panjang

Kelas Bersih:

Pembersihan umum dan ultrasonik

Tipe IC:

BGA,QFP,QFN,LGA,PGA

Tingkat pengepakan:

Paket Transportasi

halaman melengkung:

Warpage maks 0,26mm

Kapasitas:

6x7 = 42 buah

Kemasan rincian:

karton, palet

Menyediakan kemampuan:

2000 buah/hari

Deskripsi Produk

ESD Anti Static Semiconductor Waffle Chip Trays

Provide stable anti-static protection for semiconductor IC chips. Bear 125℃ high-temperature working environment. Adopt precise cross-type waffle structure to fix chips firmly and avoid collision damage. Meet strict electronic packaging industry standards. Need reliable chip storage solutions for electronic manufacturing?

Apply to semiconductor packaging testing links. Serve IC die sorting, wafer packaging and chip transportation storage scenarios. Fit integrated circuit component processing and electronic factory production lines perfectly.

Support electronic component turnover and vacuum packaging applications. Offer full custom waffle structure, cavity size and material modification services. Realize personalized tray design according to different chip models and customer requirements. Become your exclusive semiconductor packaging storage partner.

Key Features/ Benefits

Deliver effective ESD anti-static performance
Stable high-temperature resistance up to 125℃
Suitable for Delicate Fine Pitch ICs
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24171
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.8×50.8×3.94 mm
Cavity Size		4.64x4.22x0.755 mm
Matrix QTY		6x7=42 PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Apply to semiconductor packaging, IC chip testing and die sorting processes. Fit wafer processing and electronic component packaging production links perfectly.

Serve chip turnover storage, vacuum packaging and transportation scenarios. Adapt to various integrated circuit manufacturing and electronic assembly industries.

Packaging & Shipping/ Services

Adopt safe anti-pressure outer packaging to protect internal waffle trays. Provide shockproof and dustproof packaging for long-distance transportation. Support customized packaging specifications according to order quantity. Ensure intact tray delivery and stable anti-static performance during logistics.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tag:

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Kotak Lengket Gel

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Nampan Keripik Waffle Pack

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Klip Tutup Paket Wafel

Kotak Lengket Gel

Kotak Pengiriman Wafer

Kaset Wafer Logam

ESD Anti Static Semiconductor Waffle Chip Trays

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