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ESD Anti-Static Waffle Pack Trays for Semiconductor IC Chips

Nama merek:	Hiner-pack
Nomor Model:	HN24175
Moq:	500 buah
harga:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Ketentuan Pembayaran:	T/T
Kemampuan Penyediaan:	2000 buah/hari

Informasi Rinci

Deskripsi Produk

Informasi Rinci

Tempat asal:

Cina

Sertifikasi:

ROHS, ISO

Berat Baki:

Bervariasi, Biasanya Hingga 500 Gram Per Rongga

Warna:

Hitam

Jaminan Kualitas:

Jaminan pengiriman, kualitas terpercaya

Ukuran Garis Garis Besar:

50,7×50,7×7,4mm

Ukuran Rongga:

1,30x1,15x0,72mm

Incoterms:

Exw, fob, cif, ddu, ddp

Jenis cetakan:

Injeksi

Dapat digunakan kembali:

Bentuk Baki:

Persegi panjang

Kelas Bersih:

Pembersihan umum dan ultrasonik

Tipe IC:

BGA,QFP,QFN,LGA,PGA

Tingkat pengepakan:

Paket Transportasi

halaman melengkung:

Warpage maks 0,2 mm

Kapasitas:

17x18=306 buah

Kemasan rincian:

karton, palet

Menyediakan kemampuan:

2000 buah/hari

Deskripsi Produk

ESD Anti-Static Waffle Pack Trays for Semiconductor IC Chips

This tray provides reliable ESD protection for IC chips. It prevents static damage and contamination during handling. Its cross-slot structure holds components securely.

It fits semiconductor testing, die sorting, and packaging processes. It works well in cleanroom and automated production environments. It withstands high temperatures up to 125℃.

It supports IC chip turnover, storage, and logistics. It offers customizable cavity sizes and layouts. Tailored designs meet diverse semiconductor packaging needs.

Key Features/ Benefits

Deliver effective ESD anti-static performance
Withstands 125℃ high temperatures.
Offers secure IC chip storage.
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24175
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×7.4 mm
Cavity Size		1.30x1.15x0.72 mm
Matrix QTY		17x18=306 PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

It applies to semiconductor encapsulation, IC testing, die sorting, and wafer processing. It adapts to high-precision manufacturing and cleanroom operations.

It supports chip internal turnover, long-term storage, and logistics. It meets various integrated circuit processing and assembly requirements.

Packaging & Shipping/ Services

Custom cross-slot waffle tray services are available. Tailor cavity size, layout, and material for specific IC models. Create exclusive solutions to meet unique semiconductor packaging needs.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

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Kotak Lengket Gel

Kotak Pengiriman Wafer

Kaset Wafer Logam

ESD Anti-Static Waffle Pack Trays for Semiconductor IC Chips

ESD Anti-Static Waffle Pack Trays for Semiconductor IC Chips

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