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Durable Carbon Reinforced Waffle Pack Tray with Flatness Less Than 0.3mm for Temperature 80°C~120°C

Durable Carbon Reinforced Waffle Pack Tray with Flatness Less Than 0.3mm for Temperature 80°C~120°C

Nama merek: Hiner-pack
Nomor Model: HN24236
Moq: 1000
Harga: TBC
Ketentuan Pembayaran: 100% Prepayment
Kemampuan Penyediaan: 2000PCS/Day
Informasi Rinci
Tempat asal:
SHENZHEN CINA
Sertifikasi:
ISO 9001 SGS ROHS
Ukuran:
4 inci
Resistensi permukaan:
1.0x10E4~1.0x10E11Ω
Metode Pencetakan:
Cetakan Injeksi
Kerataan/Kelengkungan:
kurang dari 0,3mm
Suhu:
80°C~120°C
Kelas Bersih:
Pembersihan umum dan ultrasonik
Fitur:
Anti-statis dan tahan debu
Incoterms:
Exw, fob, cif, ddu, ddp
Packaging Details:
500 Pcs/carton(According To Actual Packing)
Supply Ability:
2000PCS/Day
Menyoroti:

Durable Carbon Reinforced Waffle Pack Tray

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Flatness Less Than 0.3mm IC Chip Tray

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Temperature 80°C~120°C Semiconductor Tray

Deskripsi Produk
Durable Carbon Reinforced Conductive Waffle Pack Trays For Automated Tool Handling The waffle pack chip tray is engineered with a core focus on extreme durability, resistance to handling stress, and compatibility with automated tool interfaces. Recognizing that trays in high-volume production cycles face repeated loading, unloading, and shipping, this product integrates advanced materials to ensure maximum lifespan and minimal process interruption. The tray is molded using a